asked by
The following steps are involved in wafer cleaning procedure (a) Removal of residual organic contaminants only (b) Stripping of thin hydrous oxide film only (c) Desorption of remaining atomic contaminants (d) All the 3 above

Please log in or register to answer this question.

Welcome to Q&A site for electrical and electronics engineering discussion for diploma, B.E./B.Tech, M.E./M.Tech, & PhD study.
If you have a new question please ask in English.
If you want to help this community answer these questions.